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NON-Memory
Canti-Type Design / MEMS & Vertical-Type Design
| DDI (Display Driver IC) |
T6371(ND1) / T6372(ND2) / T6373(ND3) / T6391(ND4) / TS6700 / ST6730 / etc. |
|---|---|
| CIS (CMOS Image Sensor) |
T2000 / IP750 / IP750EX / IP750EMP / IP750EX / J750 / Magnum iCP2M / CP1000 / etc. |
| Smart IC (Smart Integrated Circuit) |
LS3000 / Magnum SV / Socket Board / etc. |
| SoC (System On Chip) |
I-FLEX / U-FLEX300 / U-FLEX440 / V93K-Direct Dock / V93K-9.5inch / V93K-12inch / etc. |
| DC TEST | HP4070 Series Design(MAX 200fA) / HP4062 Series Design(Max 200fA) / etc. |
Memory
Samsung / SK Hynix and Others Multi Para
| Advantest | T5377, T5377S(440mm) / T5383(DRAM Test 480mm) / T5592 / etc. |
|---|---|
| Yokogawa | AL6050(440mm) / MT6060(440mm, 480mm) / MT6121(480mm) / etc. |
| FOSTES | FOS8000 / etc. |
| MLC | 8 INCH / 12 INCH and others PARA (256Para / 512Para / 858Para) / etc. |
| BIB | LC2 / HPB5 / FOCUS7500 /FOCUS7600 (48Para / 180Para / 192Para / 320Para) / HTOL / ICTC / etc. |
| Other BOARD | DUT_Board / ROGERS PCB (Leakage_Board) / Pixle LED Probe_Board / Relay_Board / Siemens Medical_Board / Other Sample Board / etc. |
Probe Card PCB Design
| Non-Memory | |
| Canti-Type | Layer : 70Layer [ ~512Para ] Design : Min 6days Manual Design |
|---|---|
| MEMS-Type | Layer : 64Layer [ ~512Para ] Design : Min 7days Manual Design |
| Vertical-Type | Layer : 100Layer [ ~8Para ] Design : Min 15days Manual Design |
| Memory | |
| Samsung / SK Hynix and Others Multi Para | 7~20 days |
|---|---|
ⓘ Negotiation required for each Probe Card Design specification