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Design Capability


LAYSYS offers better value

LAYSYS Co., Ltd.

We will meet the needs of our customers with top tier designing experts.

NON-Memory

Canti-Type Design / MEMS & Vertical-Type Design

DDI

(Display Driver IC)

T6371(ND1) / T6372(ND2) / T6373(ND3) / T6391(ND4) / TS6700 / ST6730 / etc.
CIS

(CMOS Image Sensor)

T2000 / IP750 / IP750EX / IP750EMP / IP750EX / J750 / Magnum iCP2M / CP1000 / etc.
Smart IC

(Smart Integrated Circuit)

LS3000 / Magnum SV / Socket Board / etc.
SoC

(System On Chip)

I-FLEX / U-FLEX300 / U-FLEX440 / V93K-Direct Dock / V93K-9.5inch / V93K-12inch / etc.
DC TEST HP4070 Series Design(MAX 200fA) / HP4062 Series Design(Max 200fA) / etc.

Memory

Samsung / SK Hynix and Others Multi Para

Advantest T5377, T5377S(440mm) / T5383(DRAM Test 480mm) / T5592 / etc.
Yokogawa AL6050(440mm) / MT6060(440mm, 480mm) / MT6121(480mm) / etc.
FOSTES FOS8000 / etc.
MLC 8 INCH / 12 INCH and others PARA (256Para / 512Para / 858Para) / etc.
BIB LC2 / HPB5 / FOCUS7500 /FOCUS7600 (48Para / 180Para / 192Para / 320Para) / HTOL / ICTC / etc.
Other BOARD DUT_Board / ROGERS PCB (Leakage_Board) / Pixle LED Probe_Board / Relay_Board / Siemens Medical_Board / Other Sample Board / etc.

Probe Card PCB Design

Non-Memory
Canti-Type Layer : 70Layer [ ~512Para ]
Design : Min 6days Manual Design
MEMS-Type Layer : 64Layer [ ~512Para ]
Design : Min 7days Manual Design
Vertical-Type Layer : 100Layer [ ~8Para ]
Design : Min 15days Manual Design
Memory
Samsung / SK Hynix and Others Multi Para 7~20 days

ⓘ  Negotiation required for each Probe Card Design specification